Yiming Qu

2015~2021, Zhejiang University, College of Information Science & Electronic Engineering, Electronics Science and Techonology, Ph.D. degree

2019~2020, Purdue University, School of Electrical and Computer Engineering, Microelectronics Deivces and Physics, Joint Ph.D. study

2010~2014, Hangzhou Dianzi University, School of Electronic Information, Electronic and Information Engineering, B.E. degree

From Oct. 2021, School of Communication & Electronic Engineering, associate researcher

Jul. 2021~Oct. 2021, Zhejiang University, Institute of Advanced VLSI Technology, assistant researcher

Aug. 2019~Aug. 2020, Purdue University, School of Electrical and Computer Engineering/ Birck Nanotechnology Center, visiting scholar

Yiming Qu received a B.E degree in Electronics and Information Engineering from Hangzhou Dianzi University in 2014 and a Ph. D degree in Electronic Science and Technology from Zhejiang University in 2021. During 2020 and 2021, she was a joint Ph. D student of the School of Electrical and Computer Engineering and a visiting scholar at Birck Nanotechnology Center of Purdue University, USA. In late 2021, she joined the School of Communication & Electronic Engineering as an associate researcher. Her research interests include ultra-fast semiconductor device characterization, device physics and reliability, and advanced semiconductor devices. She has authored and co-authored more than 20 research papers at top conferences like IEEE IEDM and VLSI Symposium and in top journals like IEEE Transactions on Electron Devices and IEEE Electron Device Letters. Also, she owes more than 10 patents in semiconductor device characterization. She is currently an associate researcher at East China Normal University.

IEEE IRPS Technical Committee Member of Reliability Session

2022 IEEE IRPS Chair of Reliability Testing Session 

IEEE Member, IEEE Electron Device Society Member

IEEE Young Professionals Member

Chineses Institute of Electronics Member

 · 2020 IEEE International Reliability Physics Syposium (IRPS) Best Paper Award, the very first time that a research achievement from China has won this honor, and also a rare achievement with students being the first author to win this award in recent years 

· 2020 Chinese Institute of Electronics Integrated Circuit First-Class Scholarship, the only winner in the packaging and testing category