董作院

2018.9-2024.6 华东师范大学通信与电子工程学院 微电子学与固体电子学 硕博连读

2024.7-2026.6 北京大学 集成电路学院 助理研究员

2026.7至今 华东师范大学 信息与电子工程学院 研究员

董作院，博士，华东师范大学紫江青年研究员，一直从事集成电路先进器件可靠性研究。以第一/通讯作者发表SCI/EI论文15篇，包括集成电路领域顶级会议IEEE VLSI（2篇）、IEEE TED、Advanced Materials等。主持国家自然科学基金青年基金、国家资助博士后计划等多项国家级、省部级项目，参与科技部国家重点研发计划、国家自然科学基金重点项目等。获得北京大学2025年优秀博士后称号（北大集成电路学院当年仅1人）。

IEEE Member

中国电子学会会员

依托华东师范大学集成电路学院原位先进器件中心，紧扣国家战略和集成电路产业迫切需求，沿“先进器件持续微缩”技术路线，针对28nm/14nm/3nm等工艺节点器件，结合原子尺度原位表征技术、高精度电学测试与理论模拟仿真手段，研究先进器件可靠性问题，包括极端低温工况下的可靠性退化、栅介质经时击穿（TDDB）、热载流子退化（HCD）以及电迁移（EM）等失效模式。

欢迎具有微电子、计算机、电子、半导体、物理等相关专业有志于以上方向从事科研的同学加入本课题组！

联系方式：zydong@ee.ecnu.edu.cn

1. 国家自然科学基金青年项目（C类），主持，在研

2. 国家资助博士后计划，主持，结题

3. 中国博士后基金面上项目，主持，结题

4. 科技部国家重点研发计划，项目骨干

5. 国家自然科学基金重点项目，项目骨干

代表性论文

1.    Zuoyuan Dong, Zirui Wang, Hongbo Wang, Xiaomei Li, Chen Luo, Jialu Huang, Lan Li, Zepeng Huang, Zixuan Sun, Yueyang Liu, Xing Wu, Runsheng Wang, Towards Understanding Cryogenic Reliability in FinFETs under Hot Carrier Stress: New Findings on Ge Migration, and Impacts of Tail States Evolution. 2025 Symposium on VLSI Technology and Circuits (VLSI), 2025, pp. 1–3.

2.    Zuoyuan Dong, Zixuan Sun, Xin Yang, Xiaomei Li, Yongkang Xue, Chen Luo, Puyang Cai, Zirui Wang, Shuying Wang, Yewei Zhang, Chaolun Wang, Pengpeng Ren, Zhigang Ji, Xing Wu, Runsheng Wang, Ru Huang, Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-Heating, On-State TDDB, and Layout Dependence. 2023 Symposium on VLSI Technology and Circuits (VLSI), 2023, pp. 1–2.

3.    Zuoyuan Dong, Zirui Wang, Hongbo Wang, Xiaomei Li, Chen Luo, Jialu Huang, Lan Li, Zepeng Huang, Zixuan Sun, Yueyang Liu, Xing Wu, Runsheng Wang, Investigation on Cryogenic Reliability in FinFETs under Hot Carrier Stress. IEEE Transactions on Electron Devices, 2025, 72, 7153.

4.    Zuoyuan Dong, Xiaomei Li, Zixuan Sun, Zirui Wang, Lan Li, Peng Xu, Yu Yao, Runsheng Wang, Xing Wu, Multiscale Characterization for Physical Analysis of Time-Dependent Dielectric Breakdown in Ultrathin Dielectrics of FinFETs. 2026 IEEE International Reliability Physics Symposium (IRPS), 2026, pp. 1–5.

5.     Zuoyuan Dong, Zixuan Sun, Lan Li, Zirui Wang, Changqing Ye, Yu Yao, Jialu Huang, Xiaomei Li, Xing Wu, Runsheng Wang, New insights into TDDB in FinFET based on strain analysis at the atomistic scale. 2025 IEEE International Reliability Physics Symposium (IRPS), 2025, pp. 1–4.

6.    Zuoyuan Dong, Hua Liu, Xin Yang, Jichen Fan, Hengchang Bi, Chaolun Wang, Yonghua Zhang, Chen Luo, Xinqian Chen, Xing Wu, Facile Fabrication of Paper-Based Flexible Thermoelectric Generator. npj Flexible Electronics, 2021, 5, 6.

7.    Yang Shen, Zuoyuan Dong, Yabin Sun, Hao Guo, Fan Wu, Xianglong Li, Jun Tang, Jun Liu, Xing Wu, He Tian, Tian‐Ling Ren, The Trend of 2D Transistors toward Integrated Circuits: Scaling Down and New Mechanisms. Advanced Materials, 2022, 34, e2201916.

8.    Zuoyuan Dong, Yan Zhou, Xinqian Chen, Weijian Li, Ziyu Cao, Chen Luo, Guohua Zhong, Qing Peng, Xing Wu, Xiao-Jia Chen, Effect of low-frequency optical phonons on the thermal conductivity of 2H molybdenum disulfide. Physical Review B, 2022, 105, 184301.

9.    Peng Xu, Lan Li, Jialu Huang, Yu Yao, Hengchang Bi, Jiang Xia, Zongyi Li, Zuoyuan Dong*, Xing Wu, Microstructural evolution and reliability analysis of RDL copper interconnects under high-temperature conditions. 2025 IEEE 16th International Conference on ASIC (ASICON), 2025, pp. 1–4. (Excellent Student Paper)

10.  Peng Xu, Lan Li, Yu Yao, Weikai Shi, Jiang Xia, Zongyi Li, Zuoyuan Dong*, Xing Wu, Thermally Induced Voids and Delamination in Cu RDL: Experimental and Simulation Study. 2026 Conference of Science and technology of Integrated Circuits (CSTIC), 2026, pp. 1–3.