蔡春华

2007年获得河海大学学士学位

2014年获得东南大学博士学位

2014/01--2020/10 河海大学    物联网工程学院

2020/10--至今      华东师范大学    通信与电子工程工程学院  

2007年获得河海大学学士学位、2014年获得东南大学博士学位，从事CMOS MEMS传感器的设计、制造和测试分析。以第一作者发表论文11篇，其中SCI收录5篇、EI收录6篇。在IEEE Sensors 年会上做口头报告共计4次。获得国家发明专利授权6项。主要参与863项目和国家自然科学基金项目4项.

半导体材料与器件

微纳传感与能源

柔性电子学

深度学习图像识别

欢迎同学们报考！

国家自然科学基金面上项目,2013/01-2016/12，参加。

国家自然科学基金面上项目,2011/01-2013/12，参加。

国家自然科学基金青年项目,2010/01-2012/12，参加。

部分代表性论文:  

[1]Cai, C., Wei, L., Wu, X. et al. A novel gradient thermoelectric microwave power sensors based on GaAs MMIC technology. Microsyst Technol 27, 243–249, 2021.(SCI/EI)

[2]Tan Junyan*,Cai Chunhua, An Efficient Partitioning Algorithm Based on Hypergraph for 3D Network-On-Chip Architecture Floorplanning, Journal Circuits, Systems, and Computers,28(5): 1950075.1-1950075.19,2019.(SCI/EI)

[3]Chunhua Cai, Junyan Tan^*, Di Hua, Ming Qin, Nianfang Zhu, “Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process, Scientific Reports, 8(1)：1-12. 2018. (SCI/EI)

[4]Chun-hua Cai^*, Ming Qin, “Fringing capacitance and tolerance of DRIE effect on the performance of bulk silicon comb-drive actuator”, J. Microsyst Technol, 23, (7), pp: 2727-2738, 2017. (SCI/EI)

[5]Chun-hua Cai, Ming Qin^*, “High performance bulk silicon interdigital capacitive temperature sensor based on graphene oxide”,Electronics Letters, 49, (7), 488-490, 2014. (SCI/EI)

[6]Chun-hua Cai, Ming Qin^*, “The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology”, J. Microsyst Technol, 19, (2), pp: 195-201, 2013. (SCI/EI)

[7]Chun-hua Cai ^*, Di Hua, Ming Qin, “Non-initial overlap bulk silicon comb-drive actuator with low-voltage and large-displacement”, 2016 7th International Conference on Mechanical, Industrial, and Manufacturing Technologies, MIMT 2016. Cape Town, South Africa, 2016.02.01-2016.02.03, 2016. (EI)

[8]Jidong Jin,Chun-hua Cai ^*, Dong Yang, Ming Qin, “Fringing Capacitance and Tolerance of DRIE Effect on the Performance of Bulk Silicon Comb-drive Actuator”, 3rd International Conference on Information Science and Control Engineering, ICISCE 2016, Beijing, PEOPLES R CHINA, 2016.07.08-2016.07.10, 2016. (EI)

[9]Chun-hua Cai, Ming Qin^*, “A Novel Low-Voltage Large-Displacement Bulk Silicon Comb-Drive Actuator Based on Post-CMOS Process”, in Proc. the 12th IEEE Sensors Conference, Maryland, USA, pp: 1-4, 2013. (EI)

[10]Chun-hua Cai, Ming Qin^*, “A novel approach for increasing the sensivity of bulk silicon electrothermal actuator”, In the Proc. in Proc. the 6th IEEE Asia-Pacific Conference on Transducers and Micro/Nano Technologies, Nanjing, China, 2012. (ISTP)

[11]Chun-hua Cai, Ming Qin^*, “Achieving High-performance Bulk Silicon Electrothermal Actuator on CMOS Substrate”, Applied Mechanics and Materials, 229-231, pp: 2178-2181, 2012. (EI)

[12]Chun-hua Cai, Ming Qin^*, “High-performance Bulk Silicon Interdigital Capacitive Temperature Sensor Based on Graphene Oxide”, in Proc. the 11th IEEE Sensors Conference, Taipei, Taiwan, 2012. (EI)

[13]Chun-hua Cai, Ming Qin^*, “High Performance Bulk Silicon Comb-drive ActuatorBased on Post-CMOSProcess”, in Proc. the 11th IEEE Sensors Conference, Taipei, Taiwan, 2012. (EI)

   [14]Chun-hua Cai, Ming Qin^*, “A Novel Approach for Achieving Bulk Silicon MEMS on CMOS Substrate by Au-Au Bonding”, in Proc. the 10th IEEE Sensors Conference, Limerick, Ireland, p.1518–1521, 2011. (EI)